08-0518-10 Aries Electronics
| Anzahl | Privatkunde |
|---|---|
| 2+ | 2.43 EUR |
| 10+ | 1.94 EUR |
| 100+ | 1.69 EUR |
| 500+ | 1.52 EUR |
| 1000+ | 1.36 EUR |
| 2500+ | 1.23 EUR |
| 5000+ | 1.18 EUR |
Produktrezensionen
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Technische Details 08-0518-10 Aries Electronics
Description: CONN SOCKET SIP 8POS GOLD, Packaging: Bulk, Features: Open Frame, Mounting Type: Through Hole, Type: SIP, Number of Positions or Pins (Grid): 8 (1 x 8), Termination: Solder, Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Brass, Part Status: Active.
Weitere Produktangebote 08-0518-10 nach Preis ab 1.67 EUR bis 2.7 EUR
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08-0518-10 | Aries Electronics |
 Description: CONN SOCKET SIP 8POS GOLDPackaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 8 (1 x 8) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Part Status: Active |
auf Bestellung 1623 Stücke: Lieferzeit 10-14 Tag (e) |
|
| 08-0518-10 |
|
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 8POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 8 (1 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Description: CONN SOCKET SIP 8POS GOLD
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: SIP
Number of Positions or Pins (Grid): 8 (1 x 8)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
auf Bestellung 1623 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 8+ | 2.7 EUR |
| 10+ | 2.3 EUR |
| 25+ | 2.15 EUR |
| 50+ | 2.06 EUR |
| 100+ | 1.95 EUR |
| 250+ | 1.83 EUR |
| 500+ | 1.75 EUR |
| 1000+ | 1.67 EUR |