08-1518-10 Aries Electronics
| Anzahl | Preis |
|---|---|
| 2+ | 1.57 EUR |
| 25+ | 1.51 EUR |
| 100+ | 1.44 EUR |
| 250+ | 1.21 EUR |
| 500+ | 1.11 EUR |
| 2500+ | 1.07 EUR |
| 5000+ | 1.06 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details 08-1518-10 Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD, Contact Material - Post: Brass, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 8 (2 x 4), Type: DIP, 0.2" (5.08mm) Row Spacing, Mounting Type: Through Hole, Features: Open Frame, Packaging: Bulk.
Weitere Produktangebote 08-1518-10
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
| 08-1518-10 | Hersteller : Aries Electronics |
 Description: CONN IC DIP SOCKET 8POS GOLDContact Material - Post: Brass Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 8 (2 x 4) Type: DIP, 0.2" (5.08mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Bulk |
Produkt ist nicht verfügbar |