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08-2503-30

08-2503-30 Aries Electronics

12012-dip-collet-socket.pdf
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Wire Wrap
Number of Positions or Pins (Grid): 8 (2 x 4)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.2" (5.08mm) Row Spacing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
auf Bestellung 121 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+7.34 EUR
10+6.24 EUR
25+5.85 EUR
50+5.57 EUR
100+5.3 EUR
Mindestbestellmenge: 3
Im Einkaufswagen  Stück im Wert von  UAH
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Technische Details 08-2503-30 Aries Electronics

Description: CONN IC DIP SOCKET 8POS GOLD, Contact Material - Post: Phosphor Bronze, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled, Termination: Wire Wrap, Number of Positions or Pins (Grid): 8 (2 x 4), Operating Temperature: -55°C ~ 105°C, Type: DIP, 0.2" (5.08mm) Row Spacing, Mounting Type: Through Hole, Features: Closed Frame, Packaging: Bulk.

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08-2503-30 08-2503-30 Hersteller : Aries Electronics 12012-dip-collet-socket.pdf IC & Component Sockets LO-PRO FILE COLLET WIRE WRAP 8 PINS
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