08-2513-10 Aries Electronics
auf Bestellung 198 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 3.89 EUR |
| 10+ | 3.34 EUR |
| 25+ | 3.19 EUR |
| 50+ | 3.08 EUR |
| 100+ | 2.92 EUR |
| 250+ | 2.39 EUR |
| 500+ | 2.27 EUR |
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Technische Details 08-2513-10 Aries Electronics
Description: CONN IC DIP SOCKET 8POS GOLD, Features: Closed Frame, Packaging: Bulk, Mounting Type: Through Hole, Type: DIP, 0.2" (5.08mm) Row Spacing, Operating Temperature: -55°C ~ 105°C, Number of Positions or Pins (Grid): 8 (2 x 4), Termination: Solder, Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Brass, Part Status: Active.
Weitere Produktangebote 08-2513-10 nach Preis ab 3.59 EUR bis 5.84 EUR
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08-2513-10 | Hersteller : Aries Electronics |
 Description: CONN IC DIP SOCKET 8POS GOLDFeatures: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.2" (5.08mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Part Status: Active |
auf Bestellung 1055 Stücke: Lieferzeit 10-14 Tag (e) |
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