Produkte > ARIES ELECTRONICS > 08-8375-310C

08-8375-310C Aries Electronics

13008_elevated_display_socket.pdf
Hersteller: Aries Electronics
IC & Component Sockets
auf Bestellung 62 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+16.1 EUR
10+12.54 EUR
25+12.13 EUR
50+12.07 EUR
100+11.1 EUR
250+10.72 EUR
500+10.47 EUR
Im Einkaufswagen  Stück im Wert von  UAH
Produktrezensionen
Produktbewertung abgeben

Technische Details 08-8375-310C Aries Electronics

Description: SOCKET, Packaging: Bulk, Features: Closed Frame, Elevated, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 105°C, Number of Positions or Pins (Grid): 8, Termination: Solder, Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Material - Post: Brass.

Weitere Produktangebote 08-8375-310C

Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit Privatkunde
08-8375-310C Aries Electronics 14033-pga-socket-header.pdf Description: SOCKET
Packaging: Bulk
Features: Closed Frame, Elevated
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 8
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
 Mindestbestellmenge: 13 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
08-8375-310C 14033-pga-socket-header.pdf
Hersteller: Aries Electronics
Description: SOCKET
Packaging: Bulk
Features: Closed Frame, Elevated
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 8
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Mindestbestellmenge: 13 Stücke
Im Einkaufswagen  Stück im Wert von  UAH