0955-0-15-20-71-14-11-0 Mill-Max
| Anzahl | Privatkunde |
|---|---|
| 2+ | 2.09 EUR |
| 10+ | 1.77 EUR |
| 25+ | 1.58 EUR |
| 100+ | 1.5 EUR |
| 250+ | 1.4 EUR |
| 500+ | 1.38 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details 0955-0-15-20-71-14-11-0 Mill-Max
Description: SOLDERCUP SPRING-LOADED PIN, Packaging: Bulk, Features: 26 AWG, Contact Finish: Gold, Mounting Type: Through Hole, Solder Cup, Contact Type: Sleeve & Plunger (Pogo Pins), Contact Finish Thickness: 20.0µin (0.51µm), Contact Material: Brass Alloy, Mating Cycles: 1000000, Part Status: Active, Maximum Working Height: 0.257" (6.53mm), Recommended Working Height: 0.202" (5.13mm), Minimum Working Height: 0.174" (4.42mm), Pad Layout Dimension: Circular - 0.042" (1.07mm), Plunger Size: 0.019" (0.48mm) Dia, Operating Force - Initial: 5gf, Operating Force - Mid Compression: 60gf, Current Rating (Amps): 2A.
Weitere Produktangebote 0955-0-15-20-71-14-11-0 nach Preis ab 1.29 EUR bis 2.24 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
0955-0-15-20-71-14-11-0 | Mill-Max Manufacturing Corp. |
 Description: SOLDERCUP SPRING-LOADED PINPackaging: Bulk Features: 26 AWG Contact Finish: Gold Mounting Type: Through Hole, Solder Cup Contact Type: Sleeve & Plunger (Pogo Pins) Contact Finish Thickness: 20.0µin (0.51µm) Contact Material: Brass Alloy Mating Cycles: 1000000 Part Status: Active Maximum Working Height: 0.257" (6.53mm) Recommended Working Height: 0.202" (5.13mm) Minimum Working Height: 0.174" (4.42mm) Pad Layout Dimension: Circular - 0.042" (1.07mm) Plunger Size: 0.019" (0.48mm) Dia Operating Force - Initial: 5gf Operating Force - Mid Compression: 60gf Current Rating (Amps): 2A |
auf Bestellung 4414 Stücke: Lieferzeit 10-14 Tag (e) |
|
| 0955-0-15-20-71-14-11-0 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: SOLDERCUP SPRING-LOADED PIN
Packaging: Bulk
Features: 26 AWG
Contact Finish: Gold
Mounting Type: Through Hole, Solder Cup
Contact Type: Sleeve & Plunger (Pogo Pins)
Contact Finish Thickness: 20.0µin (0.51µm)
Contact Material: Brass Alloy
Mating Cycles: 1000000
Part Status: Active
Maximum Working Height: 0.257" (6.53mm)
Recommended Working Height: 0.202" (5.13mm)
Minimum Working Height: 0.174" (4.42mm)
Pad Layout Dimension: Circular - 0.042" (1.07mm)
Plunger Size: 0.019" (0.48mm) Dia
Operating Force - Initial: 5gf
Operating Force - Mid Compression: 60gf
Current Rating (Amps): 2A
Description: SOLDERCUP SPRING-LOADED PIN
Packaging: Bulk
Features: 26 AWG
Contact Finish: Gold
Mounting Type: Through Hole, Solder Cup
Contact Type: Sleeve & Plunger (Pogo Pins)
Contact Finish Thickness: 20.0µin (0.51µm)
Contact Material: Brass Alloy
Mating Cycles: 1000000
Part Status: Active
Maximum Working Height: 0.257" (6.53mm)
Recommended Working Height: 0.202" (5.13mm)
Minimum Working Height: 0.174" (4.42mm)
Pad Layout Dimension: Circular - 0.042" (1.07mm)
Plunger Size: 0.019" (0.48mm) Dia
Operating Force - Initial: 5gf
Operating Force - Mid Compression: 60gf
Current Rating (Amps): 2A
auf Bestellung 4414 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 10+ | 2.24 EUR |
| 11+ | 1.9 EUR |
| 25+ | 1.78 EUR |
| 50+ | 1.7 EUR |
| 100+ | 1.62 EUR |
| 250+ | 1.52 EUR |
| 500+ | 1.45 EUR |
| 1000+ | 1.38 EUR |
| 2500+ | 1.29 EUR |