1-1571552-2 TE Connectivity
auf Bestellung 96 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Preis |
|---|---|
| 41+ | 3.67 EUR |
Produktrezensionen
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Technische Details 1-1571552-2 TE Connectivity
Description: CONN IC DIP SOCKET 40POS TIN, Packaging: Tube, Features: Open Frame, Mounting Type: Through Hole, Type: DIP, 0.6" (15.24mm) Row Spacing, Operating Temperature: -55°C ~ 105°C, Number of Positions or Pins (Grid): 40 (2 x 20), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Material - Post: Copper.
Weitere Produktangebote 1-1571552-2
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
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1-1571552-2 | Hersteller : TE CONNECTIVITY / PARTNER STOCK |
 Description: TE CONNECTIVITY / PARTNER STOCK - 1-1571552-2 - IC AND COMPONENT SOCKETStariffCode: 85369010 productTraceability: No rohsCompliant: YES euEccn: NLR hazardous: false rohsPhthalatesCompliant: YES usEccn: EAR99 SVHC: To Be Advised |
auf Bestellung 96 Stücke: Lieferzeit 14-21 Tag (e) |
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1-1571552-2 | Hersteller : TE Connectivity |
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1-1571552-2 | Hersteller : TE Connectivity AMP Connectors |
Description: CONN IC DIP SOCKET 40POS TIN Packaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 40 (2 x 20) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Copper |
Produkt ist nicht verfügbar |