1-1814655-1 TE Connectivity
auf Bestellung 275 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Preis |
|---|---|
| 50+ | 2.96 EUR |
| 250+ | 2.27 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details 1-1814655-1 TE Connectivity
Description: CONN SOCKET SIP 16POS GOLD, Features: Closed Frame, Packaging: Bulk, Mounting Type: Through Hole, Type: SIP, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 16 (1 x 16), Termination: Solder, Housing Material: Thermoplastic, Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: FLASH, Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 196.9µin (5.00µm), Contact Material - Post: Brass, Part Status: Last Time Buy.
Weitere Produktangebote 1-1814655-1 nach Preis ab 1.76 EUR bis 3.06 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis | ||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
1-1814655-1 | Hersteller : TE Connectivity |
 Category: Standard DIP socketsDescription: Socket: integrated circuits; SIP16; THT; 2.54mm Type of integrated: integrated circuits Application: SIP16 Electrical mounting: THT Terminal pitch: 2.54mm Sockets features: bushing contacts; round pins Contact plating: gold flash Anzahl je Verpackung: 1 Stücke |
auf Bestellung 80 Stücke: Lieferzeit 7-14 Tag (e) |
|
||||||||||||||||||||
|
|
1-1814655-1 | Hersteller : TE Connectivity |
Category: Standard DIP sockets Description: Socket: integrated circuits; SIP16; THT; 2.54mm Type of integrated: integrated circuits Application: SIP16 Electrical mounting: THT Terminal pitch: 2.54mm Sockets features: bushing contacts; round pins Contact plating: gold flash |
auf Bestellung 80 Stücke: Lieferzeit 14-21 Tag (e) |
|
||||||||||||||||||||
 |
1-1814655-1 | Hersteller : TE Connectivity AMP Connectors |
Description: CONN SOCKET SIP 16POS GOLD Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: SIP Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 16 (1 x 16) Termination: Solder Housing Material: Thermoplastic, Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 196.9µin (5.00µm) Contact Material - Post: Brass Part Status: Last Time Buy |
auf Bestellung 11307 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||||||
 |
1-1814655-1 | Hersteller : TE CONNECTIVITY |
Description: TE CONNECTIVITY - 1-1814655-1 - IC- & Baustein-Sockel, 16 Kontakt(e), SIP-Buchse, 2.54 mm, Beryllium-Kupfer tariffCode: 85369010 productTraceability: No Kontaktüberzug: Vergoldete Kontakte Steckverbindertyp: SIP-Buchse rohsCompliant: YES Rastermaß: 2.54 Anzahl der Kontakte: 16 euEccn: NLR Kontaktmaterial: Beryllium-Kupfer hazardous: false Reihenabstand: - rohsPhthalatesCompliant: YES usEccn: EAR99 Produktpalette: - SVHC: No SVHC (19-Jan-2021) |
auf Bestellung 462 Stücke: Lieferzeit 14-21 Tag (e) |