1-2199298-9 TE Connectivity AMP Connectors
Hersteller: TE Connectivity AMP Connectors
Description: CONN IC DIP SOCKET 28POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 60.0µin (1.52µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass, Copper
Part Status: Active
Description: CONN IC DIP SOCKET 28POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 60.0µin (1.52µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass, Copper
Part Status: Active
auf Bestellung 3124 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
15+ | 1.2 EUR |
50+ | 1.16 EUR |
100+ | 0.97 EUR |
250+ | 0.91 EUR |
500+ | 0.86 EUR |
1000+ | 0.75 EUR |
2500+ | 0.71 EUR |
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Technische Details 1-2199298-9 TE Connectivity AMP Connectors
Description: CONN IC DIP SOCKET 28POS TIN, Features: Open Frame, Packaging: Tube, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -40°C ~ 105°C, Number of Positions or Pins (Grid): 28 (2 x 14), Termination: Solder, Housing Material: Polybutylene Terephthalate (PBT), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 60.0µin (1.52µm), Contact Material - Mating: Phosphor Bronze, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Material - Post: Brass, Copper, Part Status: Active.
Weitere Produktangebote 1-2199298-9 nach Preis ab 0.88 EUR bis 1.62 EUR
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt | ||||||||||||
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1-2199298-9 | Hersteller : TE Connectivity | IC & Component Sockets 28P DIP SKT 300 CL LADDER |
auf Bestellung 4808 Stücke: Lieferzeit 14-28 Tag (e) |
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1-2199298-9 | Hersteller : TE CONNECTIVITY |
Description: TE CONNECTIVITY - 1-2199298-9 - IC- & Baustein-Sockel, 28 Kontakt(e), DIP-Sockel, 2.54 mm, 7.62 mm, Phosphorbronze tariffCode: 85366930 productTraceability: No Kontaktüberzug: Verzinnte Kontakte Steckverbindertyp: DIP-Sockel rohsCompliant: YES Rastermaß: 2.54mm Anzahl der Kontakte: 28Contacts euEccn: NLR Kontaktmaterial: Phosphorbronze hazardous: false Reihenabstand: 7.62mm rohsPhthalatesCompliant: YES usEccn: EAR99 Produktpalette: Multicomp Pro RJ45 Adapter SVHC: No SVHC (10-Jun-2022) |
auf Bestellung 1997 Stücke: Lieferzeit 14-21 Tag (e) |
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1-2199298-9 | Hersteller : TE Connectivity | Conn DIP Socket SKT 28 POS 2.54mm Solder ST Thru-Hole Tube |
Produkt ist nicht verfügbar |
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1-2199298-9 | Hersteller : TE Connectivity | Conn DIP Socket SKT 28 POS 2.54mm Solder ST Thru-Hole Tube |
Produkt ist nicht verfügbar |