1-2199299-2
Produktcode: 206736
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Lieblingsprodukt
Hersteller:
Steckverbinder, Reihenklemmen > Plattenverbinder
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Produktbewertung abgeben
Weitere Produktangebote 1-2199299-2 nach Preis ab 0.75 EUR bis 1.87 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||||||
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1-2199299-2 | TE Connectivity |
Category: Standard DIP socketsDescription: Socket: integrated circuits; DIP28; 15.24mm; THT; Pitch: 2.54mm Electrical mounting: THT Application: DIP28 Contact plating: tinned Type of Socket: integrated circuits Operating temperature: -40...105°C Terminal pitch: 2.54mm Row pitch: 15.24mm |
auf Bestellung 1371 Stücke: Lieferzeit 14-21 Tag (e) |
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1-2199299-2 | TE Connectivity |
IC & Component Sockets 28P DIP SKT 600 CL LADDER |
auf Bestellung 5474 Stücke: Lieferzeit 10-14 Tag (e) |
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1-2199299-2 | TE Connectivity AMP Connectors |
Description: 28P,DIP SKT,600 CL,LDR,PB FREEPackaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -40°C ~ 105°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polybutylene Terephthalate (PBT), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 60.0µin (1.52µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 60.0µin (1.52µm) Contact Material - Post: Nickel Part Status: Active |
auf Bestellung 1875 Stücke: Lieferzeit 10-14 Tag (e) |
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1-2199299-2 | TE CONNECTIVITY |
Description: TE CONNECTIVITY - 1-2199299-2 - IC- & Baustein-Sockel, 28 Kontakt(e), DIP-Sockel, 2.54 mm, 15.24 mm, PhosphorbronzetariffCode: 85366930 euEccn: NLR rohsCompliant: YES Kontaktüberzug: Verzinnte Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Phosphorbronze isCanonical: Y Anzahl der Kontakte: 28Kontakt(e) SVHC: No SVHC (21-Jan-2025) Reihenabstand: 15.24mm Steckverbinder: DIP-Sockel Produktpalette: - productTraceability: No usEccn: EAR99 Rastermaß: 2.54mm |
auf Bestellung 963 Stücke: Lieferzeit 14-21 Tag (e) |
Mindestbestellmenge: 10 Stücke Im Einkaufswagen Stück im Wert von UAH |
| 1-2199299-2 |
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Hersteller: TE Connectivity
Category: Standard DIP sockets
Description: Socket: integrated circuits; DIP28; 15.24mm; THT; Pitch: 2.54mm
Electrical mounting: THT
Application: DIP28
Contact plating: tinned
Type of Socket: integrated circuits
Operating temperature: -40...105°C
Terminal pitch: 2.54mm
Row pitch: 15.24mm
Category: Standard DIP sockets
Description: Socket: integrated circuits; DIP28; 15.24mm; THT; Pitch: 2.54mm
Electrical mounting: THT
Application: DIP28
Contact plating: tinned
Type of Socket: integrated circuits
Operating temperature: -40...105°C
Terminal pitch: 2.54mm
Row pitch: 15.24mm
auf Bestellung 1371 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 91+ | 0.94 EUR |
| 103+ | 0.83 EUR |
| 107+ | 0.8 EUR |
| 113+ | 0.75 EUR |
| 1-2199299-2 |
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Hersteller: TE Connectivity
IC & Component Sockets 28P DIP SKT 600 CL LADDER
IC & Component Sockets 28P DIP SKT 600 CL LADDER
auf Bestellung 5474 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 1.55 EUR |
| 10+ | 1.3 EUR |
| 25+ | 1.17 EUR |
| 100+ | 1.07 EUR |
| 250+ | 0.94 EUR |
| 500+ | 0.88 EUR |
| 1-2199299-2 |
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Hersteller: TE Connectivity AMP Connectors
Description: 28P,DIP SKT,600 CL,LDR,PB FREE
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 60.0µin (1.52µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 60.0µin (1.52µm)
Contact Material - Post: Nickel
Part Status: Active
Description: 28P,DIP SKT,600 CL,LDR,PB FREE
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 60.0µin (1.52µm)
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 60.0µin (1.52µm)
Contact Material - Post: Nickel
Part Status: Active
auf Bestellung 1875 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 12+ | 1.87 EUR |
| 17+ | 1.51 EUR |
| 34+ | 1.44 EUR |
| 51+ | 1.39 EUR |
| 102+ | 1.33 EUR |
| 255+ | 1.25 EUR |
| 510+ | 1.19 EUR |
| 1003+ | 1.13 EUR |
| 1-2199299-2 |
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Hersteller: TE CONNECTIVITY
Description: TE CONNECTIVITY - 1-2199299-2 - IC- & Baustein-Sockel, 28 Kontakt(e), DIP-Sockel, 2.54 mm, 15.24 mm, Phosphorbronze
tariffCode: 85366930
euEccn: NLR
rohsCompliant: YES
Kontaktüberzug: Verzinnte Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Phosphorbronze
isCanonical: Y
Anzahl der Kontakte: 28Kontakt(e)
SVHC: No SVHC (21-Jan-2025)
Reihenabstand: 15.24mm
Steckverbinder: DIP-Sockel
Produktpalette: -
productTraceability: No
usEccn: EAR99
Rastermaß: 2.54mm
Description: TE CONNECTIVITY - 1-2199299-2 - IC- & Baustein-Sockel, 28 Kontakt(e), DIP-Sockel, 2.54 mm, 15.24 mm, Phosphorbronze
tariffCode: 85366930
euEccn: NLR
rohsCompliant: YES
Kontaktüberzug: Verzinnte Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Phosphorbronze
isCanonical: Y
Anzahl der Kontakte: 28Kontakt(e)
SVHC: No SVHC (21-Jan-2025)
Reihenabstand: 15.24mm
Steckverbinder: DIP-Sockel
Produktpalette: -
productTraceability: No
usEccn: EAR99
Rastermaß: 2.54mm
auf Bestellung 963 Stücke:
Lieferzeit 14-21 Tag (e)



