Technische Details 1-2324271-2 TE Connectivity
Description: LEFT SEGMEN LGA4189-4 SOCKET-P4, Part Status: Active, Contact Material - Post: Copper Alloy, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Finish - Post: Gold, Pitch - Post: 0.034" (0.86mm), Contact Material - Mating: Copper Alloy, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.039" (1.00mm), Housing Material: Thermoplastic, Termination: Solder, Number of Positions or Pins (Grid): 2092, Operating Temperature: -25°C ~ 100°C, Type: LGA 4189, Mounting Type: Surface Mount, Features: Open Frame, Packaging: Tray.
Weitere Produktangebote 1-2324271-2 nach Preis ab 34.03 EUR bis 46.22 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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1-2324271-2 | TE Connectivity |
Conn LGA Socket RCP 2097 POS Solder ST SMD Tray |
auf Bestellung 55 Stücke: Lieferzeit 14-21 Tag (e) |
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1-2324271-2 | TE Connectivity |
Conn LGA Socket RCP 2097 POS Solder ST SMD Tray |
auf Bestellung 132 Stücke: Lieferzeit 14-21 Tag (e) |
|
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1-2324271-2 | TE Connectivity AMP Connectors |
Description: LEFT SEGMEN LGA4189-4 SOCKET-P4Part Status: Active Contact Material - Post: Copper Alloy Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Finish - Post: Gold Pitch - Post: 0.034" (0.86mm) Contact Material - Mating: Copper Alloy Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.039" (1.00mm) Housing Material: Thermoplastic Termination: Solder Number of Positions or Pins (Grid): 2092 Operating Temperature: -25°C ~ 100°C Type: LGA 4189 Mounting Type: Surface Mount Features: Open Frame Packaging: Tray |
auf Bestellung 3584 Stücke: Lieferzeit 10-14 Tag (e) |
|
| 1-2324271-2 |
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Hersteller: TE Connectivity
Conn LGA Socket RCP 2097 POS Solder ST SMD Tray
Conn LGA Socket RCP 2097 POS Solder ST SMD Tray
auf Bestellung 55 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 6+ | 34.15 EUR |
| 1-2324271-2 |
![]() |
Hersteller: TE Connectivity
Conn LGA Socket RCP 2097 POS Solder ST SMD Tray
Conn LGA Socket RCP 2097 POS Solder ST SMD Tray
auf Bestellung 132 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 12+ | 36.26 EUR |
| 60+ | 35.5 EUR |
| 108+ | 34.03 EUR |
| 1-2324271-2 |
![]() |
Hersteller: TE Connectivity AMP Connectors
Description: LEFT SEGMEN LGA4189-4 SOCKET-P4
Part Status: Active
Contact Material - Post: Copper Alloy
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Finish - Post: Gold
Pitch - Post: 0.034" (0.86mm)
Contact Material - Mating: Copper Alloy
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.039" (1.00mm)
Housing Material: Thermoplastic
Termination: Solder
Number of Positions or Pins (Grid): 2092
Operating Temperature: -25°C ~ 100°C
Type: LGA 4189
Mounting Type: Surface Mount
Features: Open Frame
Packaging: Tray
Description: LEFT SEGMEN LGA4189-4 SOCKET-P4
Part Status: Active
Contact Material - Post: Copper Alloy
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Finish - Post: Gold
Pitch - Post: 0.034" (0.86mm)
Contact Material - Mating: Copper Alloy
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.039" (1.00mm)
Housing Material: Thermoplastic
Termination: Solder
Number of Positions or Pins (Grid): 2092
Operating Temperature: -25°C ~ 100°C
Type: LGA 4189
Mounting Type: Surface Mount
Features: Open Frame
Packaging: Tray
auf Bestellung 3584 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 46.22 EUR |
| 12+ | 38.77 EUR |
| 36+ | 35.88 EUR |
| 60+ | 35.35 EUR |



