1-390263-1 TE Connectivity
auf Bestellung 5261 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Preis |
|---|---|
| 511+ | 0.29 EUR |
| 1700+ | 0.27 EUR |
| 3400+ | 0.26 EUR |
Produktrezensionen
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Technische Details 1-390263-1 TE Connectivity
Description: CONN IC DIP SOCKET 28POS TIN, Packaging: Box, Features: Open Frame, Mounting Type: Through Hole, Type: DIP, 0.6" (15.24mm) Row Spacing, Operating Temperature: -40°C ~ 105°C, Number of Positions or Pins (Grid): 28 (2 x 14), Termination: Solder, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 60.0µin (1.52µm), Contact Material - Mating: Phosphor Bronze, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 60.0µin (1.52µm), Contact Material - Post: Phosphor Bronze.
Weitere Produktangebote 1-390263-1
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1-390263-1 | Hersteller : TE Connectivity |
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Description: CONN IC DIP SOCKET 28POS TIN Packaging: Box Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -40°C ~ 105°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 60.0µin (1.52µm) Contact Material - Mating: Phosphor Bronze Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 60.0µin (1.52µm) Contact Material - Post: Phosphor Bronze |
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