10-8335-610C Aries Electronics
| Anzahl | Privatkunde |
|---|---|
| 1+ | 19.62 EUR |
| 10+ | 17.66 EUR |
| 25+ | 16.62 EUR |
| 50+ | 16.21 EUR |
| 100+ | 13.57 EUR |
| 250+ | 12.73 EUR |
| 500+ | 12.42 EUR |
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Lieferzeit:
10-14 Tag (e)
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Technische Details 10-8335-610C Aries Electronics
Description: CONN IC DIP SOCKET 10POS GOLD, Features: Closed Frame, Elevated, Packaging: Bulk, Mounting Type: Through Hole, Type: DIP, 0.6" (15.24mm) Row Spacing, Operating Temperature: -55°C ~ 105°C, Number of Positions or Pins (Grid): 10 (2 x 5), Termination: Solder, Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Material - Post: Brass.
Weitere Produktangebote 10-8335-610C
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde |
|---|---|---|---|---|---|
| 10-8335-610C | Aries Electronics |
 Description: CONN IC DIP SOCKET 10POS GOLDFeatures: Closed Frame, Elevated Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 10 (2 x 5) Termination: Solder Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 64 Stücke Im Einkaufswagen Stück im Wert von UAH |
| 10-8335-610C |
|
Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 10POS GOLD
Features: Closed Frame, Elevated
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Produkt ist nicht verfügbar
Mindestbestellmenge: 64 Stücke
Im Einkaufswagen
Stück im Wert von UAH