10114830-10114LF Amphenol Communications Solutions-FCI
Hersteller: Amphenol Communications Solutions-FCI
1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 14 Positions
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Technische Details 10114830-10114LF Amphenol Communications Solutions-FCI
Description: CONN HEADER SMD R/A 14POS 1.25MM, Insulation Material: Liquid Crystal Polymer (LCP), Shrouding: Shrouded - 4 Wall, Insulation Height: 0.134" (3.40mm), Contact Shape: Rectangular, Contact Finish - Post: Tin, Contact Finish - Mating: Tin, Pitch - Mating: 0.049" (1.25mm), Insulation Color: Natural, Contact Material: Phosphor Bronze, Material Flammability Rating: UL94 V-0, Packaging: Tape & Reel (TR), Termination: Solder, Number of Positions Loaded: All, Fastening Type: Detent Lock, Contact Type: Male Pin, Operating Temperature: -40°C ~ 105°C, Style: Board to Cable/Wire, Number of Rows: 1, Number of Positions: 14, Mounting Type: Surface Mount, Right Angle, Current Rating (Amps): 1A, Voltage Rating: 125V, Connector Type: Header, Features: Solder Retention.
Weitere Produktangebote 10114830-10114LF nach Preis ab 0.79 EUR bis 0.79 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Preis |
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|---|---|---|---|---|---|---|---|
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10114830-10114LF | Amphenol Communications Solutions-FCI |
1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 14 Positions |
auf Bestellung 2522 Stücke: Lieferzeit 14-21 Tag (e) |
|
| 10114830-10114LF |
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Hersteller: Amphenol Communications Solutions-FCI
1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 14 Positions
1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 14 Positions
auf Bestellung 2522 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Preis |
|---|---|
| 187+ | 0.79 EUR |

