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104-13-950-41-770000 Mill-Max Manufacturing Corp.


2017-11%3A096M.pdf Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 50POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Number of Positions or Pins (Grid): 50 (2 x 25)
Termination: Press-Fit
Housing Material: Thermoplastic
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
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Technische Details 104-13-950-41-770000 Mill-Max Manufacturing Corp.

Description: CONN IC DIP SOCKET 50POS GOLD, Features: Open Frame, Packaging: Tube, Mounting Type: Through Hole, Type: DIP, 0.9" (22.86mm) Row Spacing, Number of Positions or Pins (Grid): 50 (2 x 25), Termination: Press-Fit, Housing Material: Thermoplastic, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Material - Post: Brass Alloy.

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104-13-950-41-770000 Hersteller : Mill-Max MMMC_S_A0000088332_1-2552938.pdf IC & Component Sockets 50PIN SKT .175L
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