105430-1204 MOLEX
Hersteller: MOLEX
Description: MOLEX - 105430-1204 - Stiftleiste, schwarz, Wire-to-Board, 2.5 mm, 1 Reihe(n), 4 Kontakt(e)
tariffCode: 85369010
euEccn: NLR
rohsCompliant: YES
Nennkontaktstrom: 6.5A
Kontaktüberzug: Vergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Messing
isCanonical: Y
Steckverbinderkragen: Mit Kragen
Anzahl der Kontakte: 4Kontakt(e)
SVHC: No SVHC (21-Jan-2025)
Steckverbindersysteme: Wire-to-Board
Steckverbinder: PCB-Stiftleiste
Produktpalette: Nano-Fit 105430 Series
productTraceability: No
Kontaktanschluss: Oberflächenmontage, abgewinkelt
usEccn: EAR99
Steckverbinderausrichtung: Abgewinkelt
Anzahl der Reihen: 1Reihe(n)
Steckverbindermaterial: LCP (Flüssigkristallpolymer)
Rastermaß: 2.5mm
| Anzahl | Privatkunde |
|---|---|
| 1500+ | 5.02 EUR |
Artikel auf Bestellung
Nicht an unserem Lager — wir beziehen ihn nach Ihrer Bestellung vom Lieferantenlager.
Lieferzeit:
14-21 Tag (e)
Mindestmenge:
1500 Stücke
Produktrezensionen
Produktbewertung abgeben
Technische Details 105430-1204 MOLEX
Description: CONN HEADER SMD R/A 4POS 2.5MM, Features: Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Header, Voltage Rating: 250VAC, Current Rating (Amps): Varies by Wire Gauge, Mounting Type: Surface Mount, Right Angle, Number of Positions: 4, Number of Rows: 1, Style: Board to Cable/Wire, Operating Temperature: -40°C ~ 115°C, Contact Type: Male Pin, Fastening Type: Latch Holder, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Brass, Insulation Color: Black, Pitch - Mating: 0.098" (2.50mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 15.0µin (0.38µm), Contact Finish - Post: Tin, Part Status: Active, Contact Shape: Square, Insulation Height: 0.275" (6.99mm), Shrouding: Shrouded - 4 Wall, Insulation Material: Liquid Crystal Polymer (LCP).
Weitere Produktangebote 105430-1204 nach Preis ab 2.92 EUR bis 6.81 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||||
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105430-1204 | Molex |
 Headers & Wire Housings NANO-FIT HDR SMT RA SGL 4CKT 15AU BLK |
auf Bestellung 37 Stücke: Lieferzeit 10-14 Tag (e) |
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1054301204 | Molex |
Description: CONN HEADER SMD R/A 4POS 2.5MM Features: Solder Retention Packaging: Cut Tape (CT) Connector Type: Header Voltage Rating: 250VAC Current Rating (Amps): Varies by Wire Gauge Mounting Type: Surface Mount, Right Angle Number of Positions: 4 Number of Rows: 1 Style: Board to Cable/Wire Operating Temperature: -40°C ~ 115°C Contact Type: Male Pin Fastening Type: Latch Holder Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Brass Insulation Color: Black Pitch - Mating: 0.098" (2.50mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 15.0µin (0.38µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Insulation Height: 0.275" (6.99mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP) |
auf Bestellung 495 Stücke: Lieferzeit 10-14 Tag (e) |
|
| 105430-1204 |
|
Hersteller: Molex
Headers & Wire Housings NANO-FIT HDR SMT RA SGL 4CKT 15AU BLK
Headers & Wire Housings NANO-FIT HDR SMT RA SGL 4CKT 15AU BLK
auf Bestellung 37 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 5.59 EUR |
| 10+ | 4.94 EUR |
| 100+ | 3.94 EUR |
| 500+ | 3.8 EUR |
| 1000+ | 3.22 EUR |
| 2500+ | 3.01 EUR |
| 5000+ | 2.92 EUR |
| 1054301204 |
|
Hersteller: Molex
Description: CONN HEADER SMD R/A 4POS 2.5MM
Features: Solder Retention
Packaging: Cut Tape (CT)
Connector Type: Header
Voltage Rating: 250VAC
Current Rating (Amps): Varies by Wire Gauge
Mounting Type: Surface Mount, Right Angle
Number of Positions: 4
Number of Rows: 1
Style: Board to Cable/Wire
Operating Temperature: -40°C ~ 115°C
Contact Type: Male Pin
Fastening Type: Latch Holder
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Brass
Insulation Color: Black
Pitch - Mating: 0.098" (2.50mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Shape: Square
Insulation Height: 0.275" (6.99mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Liquid Crystal Polymer (LCP)
Description: CONN HEADER SMD R/A 4POS 2.5MM
Features: Solder Retention
Packaging: Cut Tape (CT)
Connector Type: Header
Voltage Rating: 250VAC
Current Rating (Amps): Varies by Wire Gauge
Mounting Type: Surface Mount, Right Angle
Number of Positions: 4
Number of Rows: 1
Style: Board to Cable/Wire
Operating Temperature: -40°C ~ 115°C
Contact Type: Male Pin
Fastening Type: Latch Holder
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Brass
Insulation Color: Black
Pitch - Mating: 0.098" (2.50mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Shape: Square
Insulation Height: 0.275" (6.99mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Liquid Crystal Polymer (LCP)
auf Bestellung 495 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 4+ | 6.81 EUR |
| 10+ | 5.78 EUR |
| 100+ | 4.91 EUR |