11-0511-10 Aries Electronics
| Anzahl | Preis |
|---|---|
| 1+ | 11.53 EUR |
| 10+ | 9.87 EUR |
| 25+ | 9.56 EUR |
| 50+ | 7.11 EUR |
| 500+ | 6.9 EUR |
| 1000+ | 6.49 EUR |
| 2500+ | 6.32 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details 11-0511-10 Aries Electronics
Description: CONN SOCKET SIP 11POS TIN, Part Status: Active, Contact Material - Post: Phosphor Bronze, Contact Finish Thickness - Post: 50.0µin (1.27µm), Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Phosphor Bronze, Contact Finish Thickness - Mating: 50.0µin (1.27µm), Contact Finish - Mating: Tin, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 11 (1 x 11), Operating Temperature: -55°C ~ 105°C, Type: SIP, Mounting Type: Through Hole, Packaging: Bulk.
Weitere Produktangebote 11-0511-10
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
| 11-0511-10 | Hersteller : Aries Electronics |
 Description: CONN SOCKET SIP 11POS TINPart Status: Active Contact Material - Post: Phosphor Bronze Contact Finish Thickness - Post: 50.0µin (1.27µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Phosphor Bronze Contact Finish Thickness - Mating: 50.0µin (1.27µm) Contact Finish - Mating: Tin Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 11 (1 x 11) Operating Temperature: -55°C ~ 105°C Type: SIP Mounting Type: Through Hole Packaging: Bulk |
Produkt ist nicht verfügbar |