110-13-314-10-002000 Mill-Max Manufacturing Corp.
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 14POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7), 8 Loaded
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
| Anzahl | Preis |
|---|---|
| 1+ | 26.24 EUR |
| 10+ | 22.29 EUR |
| 28+ | 20.73 EUR |
| 56+ | 19.74 EUR |
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Technische Details 110-13-314-10-002000 Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 14POS GOLD, Features: Open Frame, Packaging: Tube, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 14 (2 x 7), 8 Loaded, Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Material - Post: Brass Alloy.
Weitere Produktangebote 110-13-314-10-002000 nach Preis ab 13.46 EUR bis 20.87 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung |
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| 110-13-314-10-002000 | Hersteller : Mill-Max |
IC & Component Sockets 8P RELAY SKT 10u Au |
auf Bestellung 44 Stücke: Lieferzeit 10-14 Tag (e) |
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110-13-314-10-002000 | Hersteller : Mill-Max Mfg. Corp. |
DIP RELAY SELECTIVELY LOADED SOCKET FOR DUAL-IN-LINE RELAYS THROUGH HOLE ACCEPTS .015-.025 LEADS |
Produkt ist nicht verfügbar |