auf Bestellung 526 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 6.34 EUR |
| 10+ | 5.07 EUR |
| 112+ | 4.42 EUR |
| 256+ | 4.31 EUR |
| 512+ | 3.66 EUR |
| 1008+ | 3.41 EUR |
| 5008+ | 3.4 EUR |
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Technische Details 110-13-324-41-001000 Mill-Max
Description: CONN IC DIP SOCKET 24POS GOLD, Packaging: Tube, Features: Open Frame, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 24 (2 x 12), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Material - Post: Brass Alloy.
Weitere Produktangebote 110-13-324-41-001000 nach Preis ab 3.74 EUR bis 6.46 EUR
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110-13-324-41-001000 | Hersteller : Mill-Max Manufacturing Corp. |
 Description: CONN IC DIP SOCKET 24POS GOLDPackaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy |
auf Bestellung 1289 Stücke: Lieferzeit 10-14 Tag (e) |
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