110-13-324-41-001000 Mill-Max Manufacturing Corp.
Hersteller: Mill-Max Manufacturing Corp.Description: CONN IC DIP SOCKET 24POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
auf Bestellung 1289 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 3+ | 6.46 EUR |
| 10+ | 5.86 EUR |
| 25+ | 5.55 EUR |
| 50+ | 5.42 EUR |
| 100+ | 5.16 EUR |
| 250+ | 4.52 EUR |
| 500+ | 4.39 EUR |
| 1000+ | 3.74 EUR |
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Technische Details 110-13-324-41-001000 Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 24POS GOLD, Packaging: Tube, Features: Open Frame, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 24 (2 x 12), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Material - Post: Brass Alloy.
Weitere Produktangebote 110-13-324-41-001000 nach Preis ab 3.84 EUR bis 7.46 EUR
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110-13-324-41-001000 | Hersteller : Mill-Max |
IC & Component Sockets 24P GLD PIN GLD CONT |
auf Bestellung 427 Stücke: Lieferzeit 10-14 Tag (e) |
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