110-13-324-41-801000 Mill-Max Mfg. Corp.
Hersteller: Mill-Max Mfg. Corp.
Conn DIP Capacitor Socket SKT 24 POS 2.54mm Solder ST Thru-Hole Tube
| Anzahl | Privatkunde |
|---|---|
| 10+ | 18.37 EUR |
Artikel auf Bestellung
Nicht an unserem Lager — wir beziehen ihn nach Ihrer Bestellung vom Lieferantenlager.
Lieferzeit:
14-21 Tag (e)
Mindestmenge:
10 Stücke
Produktrezensionen
Produktbewertung abgeben
Technische Details 110-13-324-41-801000 Mill-Max Mfg. Corp.
Description: CONN IC DIP SOCKET 24POS GOLD, Features: Open Frame, Decoupling Capacitor, Packaging: Tube, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 24 (2 x 12), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Material - Post: Brass Alloy, Part Status: Active.
Weitere Produktangebote 110-13-324-41-801000 nach Preis ab 20.92 EUR bis 46.27 EUR
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110-13-324-41-801000 | Mill-Max |
IC & Component Sockets 24P GLD PIN GLD CONT |
auf Bestellung 87 Stücke: Lieferzeit 10-14 Tag (e) |
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110-13-324-41-801000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 24POS GOLD Features: Open Frame, Decoupling Capacitor Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy Part Status: Active |
auf Bestellung 55 Stücke: Lieferzeit 10-14 Tag (e) |
|
| 110-13-324-41-801000 |
|
Hersteller: Mill-Max
IC & Component Sockets 24P GLD PIN GLD CONT
IC & Component Sockets 24P GLD PIN GLD CONT
auf Bestellung 87 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 32.4 EUR |
| 10+ | 24.92 EUR |
| 25+ | 24.91 EUR |
| 256+ | 24.31 EUR |
| 512+ | 22.26 EUR |
| 1008+ | 20.92 EUR |
| 110-13-324-41-801000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 24POS GOLD
Features: Open Frame, Decoupling Capacitor
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC DIP SOCKET 24POS GOLD
Features: Open Frame, Decoupling Capacitor
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
auf Bestellung 55 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 46.27 EUR |
| 16+ | 36.16 EUR |
| 32+ | 34.01 EUR |