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110-13-624-41-801000

110-13-624-41-801000 Mill-Max


MMMC_S_A0000088726_1-2552834.pdf Hersteller: Mill-Max
IC & Component Sockets 24P GLD PIN GLD CONT
auf Bestellung 76 Stücke:

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10+16.02 EUR
25+15.08 EUR
48+13.55 EUR
112+11.30 EUR
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Technische Details 110-13-624-41-801000 Mill-Max

Description: CONN IC DIP SOCKET 24POS GOLD, Packaging: Tube, Features: Open Frame, Decoupling Capacitor, Mounting Type: Through Hole, Type: DIP, 0.6" (15.24mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 24 (2 x 12), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Material - Post: Brass Alloy.

Weitere Produktangebote 110-13-624-41-801000

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110-13-624-41-801000 110-13-624-41-801000 Hersteller : Mill-Max Manufacturing Corp. 2017-11%3A098.pdf Description: CONN IC DIP SOCKET 24POS GOLD
Packaging: Tube
Features: Open Frame, Decoupling Capacitor
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH