| Anzahl | Preis |
|---|---|
| 1+ | 22.51 EUR |
| 10+ | 18.32 EUR |
| 25+ | 16.4 EUR |
| 112+ | 14.19 EUR |
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Technische Details 110-41-324-41-001000 Mill-Max
Description: CONN IC DIP SOCKET 24POS GOLD, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Thermoplastic, Termination: Solder, Number of Positions or Pins (Grid): 24 (2 x 12), Type: DIP, 0.3" (7.62mm) Row Spacing, Mounting Type: Through Hole, Features: Open Frame, Packaging: Tube, Part Status: Active, Contact Material - Post: Brass Alloy, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper.
Weitere Produktangebote 110-41-324-41-001000 nach Preis ab 19.19 EUR bis 26.1 EUR
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110-41-324-41-001000 | Hersteller : Mill-Max Manufacturing Corp. |
 Description: CONN IC DIP SOCKET 24POS GOLDContact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Thermoplastic Termination: Solder Number of Positions or Pins (Grid): 24 (2 x 12) Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Tube Part Status: Active Contact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper |
auf Bestellung 46 Stücke: Lieferzeit 10-14 Tag (e) |
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