Technische Details 110-43-310-41-105000 Mill-Max Mfg. Corp.
Description: CONN IC SKT DBL, Features: Open Frame, Packaging: Tube, Mounting Type: Surface Mount, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 10 (2 x 5), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Brass Alloy.
Weitere Produktangebote 110-43-310-41-105000 nach Preis ab 13.23 EUR bis 30.84 EUR
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110-43-310-41-105000 | Mill-Max Mfg. Corp. |
 Conn DIP Socket RCP 10 POS 2.54mm Solder ST SMD Tube |
auf Bestellung 200 Stücke: Lieferzeit 14-21 Tag (e) |
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110-43-310-41-105000 | Mill-Max |
IC & Component Sockets 10P SMT SKT 200u Sn |
auf Bestellung 118 Stücke: Lieferzeit 10-14 Tag (e) |
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| 110-43-310-41-105000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Features: Open Frame Packaging: Tube Mounting Type: Surface Mount Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 10 (2 x 5) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy |
auf Bestellung 55 Stücke: Lieferzeit 10-14 Tag (e) |
|
| 110-43-310-41-105000 |
|
Hersteller: Mill-Max Mfg. Corp.
Conn DIP Socket RCP 10 POS 2.54mm Solder ST SMD Tube
Conn DIP Socket RCP 10 POS 2.54mm Solder ST SMD Tube
auf Bestellung 200 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 80+ | 18.02 EUR |
| 110-43-310-41-105000 |
|
Hersteller: Mill-Max
IC & Component Sockets 10P SMT SKT 200u Sn
IC & Component Sockets 10P SMT SKT 200u Sn
auf Bestellung 118 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 25.53 EUR |
| 25+ | 23.15 EUR |
| 40+ | 22.05 EUR |
| 120+ | 21.09 EUR |
| 280+ | 15.4 EUR |
| 520+ | 14.14 EUR |
| 1000+ | 13.23 EUR |
| 110-43-310-41-105000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Features: Open Frame
Packaging: Tube
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Description: CONN IC SKT DBL
Features: Open Frame
Packaging: Tube
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
auf Bestellung 55 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 30.84 EUR |
| 10+ | 26.74 EUR |
| 40+ | 24.97 EUR |