110-43-314-41-801000 Mill-Max Manufacturing Corp.
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 14POS GOLD
Packaging: Tube
Features: Open Frame, Decoupling Capacitor
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC DIP SOCKET 14POS GOLD
Packaging: Tube
Features: Open Frame, Decoupling Capacitor
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
auf Bestellung 44 Stücke:
Lieferzeit 21-28 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
2+ | 13.03 EUR |
10+ | 11.81 EUR |
25+ | 11.19 EUR |
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Technische Details 110-43-314-41-801000 Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 14POS GOLD, Packaging: Tube, Features: Open Frame, Decoupling Capacitor, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 14 (2 x 7), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Brass Alloy, Part Status: Active.
Weitere Produktangebote 110-43-314-41-801000 nach Preis ab 7.8 EUR bis 14.17 EUR
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt | ||||||||||||||||
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110-43-314-41-801000 | Hersteller : Mill-Max | IC & Component Sockets 14P TIN PIN GLD CONT |
auf Bestellung 148 Stücke: Lieferzeit 14-28 Tag (e) |
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110-43-314-41-801000 | Hersteller : MILL MAX |
Description: MILL MAX - 110-43-314-41-801000 - DIP SOCKET, 14 POSITION, THROUGH HOLE tariffCode: 85366930 productTraceability: Yes-Date/Lot Code Kontaktüberzug: Gold Plated Contacts Steckverbindertyp: DIP Socket rohsCompliant: Y-EX Rastermaß: 2.54mm Anzahl der Kontakte: 14Kontakt(e) euEccn: NLR Kontaktmaterial: Beryllium Copper hazardous: false Reihenabstand: 7.62mm rohsPhthalatesCompliant: YES directShipCharge: 25 usEccn: EAR99 Produktpalette: 110 Series SVHC: To Be Advised |
auf Bestellung 52 Stücke: Lieferzeit 14-21 Tag (e) |