| Anzahl | Preis |
|---|---|
| 1+ | 4.72 EUR |
| 10+ | 3.8 EUR |
| 22+ | 3.52 EUR |
| 110+ | 3.38 EUR |
| 264+ | 3.19 EUR |
| 1012+ | 2.89 EUR |
| 2508+ | 2.71 EUR |
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Technische Details 110-43-318-41-001000 Mill-Max
Description: CONN IC DIP SOCKET 18POS GOLD, Part Status: Active, Contact Material - Post: Brass Alloy, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Operating Temperature: -55°C ~ 125°C, Type: DIP, 0.3" (7.62mm) Row Spacing, Mounting Type: Through Hole, Features: Open Frame, Packaging: Tube, Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Termination: Solder, Number of Positions or Pins (Grid): 18 (2 x 9).
Weitere Produktangebote 110-43-318-41-001000 nach Preis ab 2.66 EUR bis 5.02 EUR
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110-43-318-41-001000 | Hersteller : Mill-Max Manufacturing Corp. |
 Description: CONN IC DIP SOCKET 18POS GOLDPart Status: Active Contact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 30.0µin (0.76µm) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Tube Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 18 (2 x 9) |
auf Bestellung 317 Stücke: Lieferzeit 10-14 Tag (e) |
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