| Anzahl | Privatkunde |
|---|---|
| 1+ | 6.22 EUR |
| 10+ | 5.13 EUR |
| 22+ | 4.74 EUR |
| 110+ | 4.57 EUR |
| 264+ | 4.25 EUR |
| 506+ | 4.08 EUR |
| 1012+ | 3.62 EUR |
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Technische Details 110-43-318-41-001000 Mill-Max
Description: CONN IC DIP SOCKET 18POS GOLD, Part Status: Active, Contact Material - Post: Brass Alloy, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Operating Temperature: -55°C ~ 125°C, Type: DIP, 0.3" (7.62mm) Row Spacing, Mounting Type: Through Hole, Features: Open Frame, Packaging: Tube, Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Termination: Solder, Number of Positions or Pins (Grid): 18 (2 x 9).
Weitere Produktangebote 110-43-318-41-001000 nach Preis ab 4.06 EUR bis 6.31 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||||
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110-43-318-41-001000 | Mill-Max Manufacturing Corp. |
 Description: CONN IC DIP SOCKET 18POS GOLDPart Status: Active Contact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 30.0µin (0.76µm) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Tube Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 18 (2 x 9) |
auf Bestellung 559 Stücke: Lieferzeit 10-14 Tag (e) |
|
| 110-43-318-41-001000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 18POS GOLD
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 18 (2 x 9)
Description: CONN IC DIP SOCKET 18POS GOLD
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 18 (2 x 9)
auf Bestellung 559 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 4+ | 6.31 EUR |
| 22+ | 5.06 EUR |
| 44+ | 4.82 EUR |
| 66+ | 4.68 EUR |
| 110+ | 4.51 EUR |
| 264+ | 4.25 EUR |
| 506+ | 4.06 EUR |