| Anzahl | Preis |
|---|---|
| 1+ | 7.52 EUR |
| 12+ | 6.32 EUR |
| 24+ | 5.83 EUR |
| 60+ | 5.61 EUR |
| 108+ | 5.39 EUR |
| 252+ | 5.07 EUR |
| 504+ | 4.82 EUR |
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Technische Details 110-43-632-41-001000 Mill-Max
Description: CONN IC DIP SOCKET 32POS GOLD, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Termination: Solder, Number of Positions or Pins (Grid): 32 (2 x 16), Operating Temperature: -55°C ~ 125°C, Type: DIP, 0.6" (15.24mm) Row Spacing, Mounting Type: Through Hole, Features: Open Frame, Packaging: Tube, Contact Material - Post: Brass Alloy, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm).
Weitere Produktangebote 110-43-632-41-001000 nach Preis ab 4.63 EUR bis 7.55 EUR
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110-43-632-41-001000 | Hersteller : Mill-Max Manufacturing Corp. |
 Description: CONN IC DIP SOCKET 32POS GOLDHousing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 32 (2 x 16) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.6" (15.24mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Tube Contact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) |
auf Bestellung 1372 Stücke: Lieferzeit 10-14 Tag (e) |
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