110-44-632-41-001000 Mill-Max Manufacturing Corp.
Hersteller: Mill-Max Manufacturing Corp.Description: CONN IC DIP SOCKET 32POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
auf Bestellung 2361 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 5+ | 3.57 EUR |
| 12+ | 2.99 EUR |
| 36+ | 2.77 EUR |
| 60+ | 2.67 EUR |
| 108+ | 2.56 EUR |
| 252+ | 2.41 EUR |
| 504+ | 2.30 EUR |
| 1008+ | 2.19 EUR |
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Technische Details 110-44-632-41-001000 Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 32POS TIN, Features: Open Frame, Packaging: Tube, Mounting Type: Through Hole, Type: DIP, 0.6" (15.24mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 32 (2 x 16), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 100.0µin (2.54µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Brass Alloy.
Weitere Produktangebote 110-44-632-41-001000 nach Preis ab 2.38 EUR bis 4.28 EUR
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110-44-632-41-001000 | Hersteller : Mill-Max |
IC & Component Sockets 32P TIN PIN TIN CONT |
auf Bestellung 935 Stücke: Lieferzeit 10-14 Tag (e) |
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