110-47-328-41-001000 Mill-Max
auf Bestellung 819 Stücke:
Lieferzeit 14-28 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
11+ | 4.99 EUR |
13+ | 4.06 EUR |
112+ | 3.87 EUR |
252+ | 3.48 EUR |
504+ | 3.22 EUR |
1008+ | 2.76 EUR |
2506+ | 2.57 EUR |
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Technische Details 110-47-328-41-001000 Mill-Max
Description: CONN IC DIP SOCKET 28POS GOLD, Packaging: Tube, Features: Open Frame, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 28 (2 x 14), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: FLASH, Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Brass Alloy, Part Status: Active.
Weitere Produktangebote 110-47-328-41-001000 nach Preis ab 4.16 EUR bis 5.36 EUR
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110-47-328-41-001000 | Hersteller : Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 28POS GOLD Packaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
auf Bestellung 240 Stücke: Lieferzeit 21-28 Tag (e) |
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