110-47-624-41-001000 Mill-Max
| Anzahl | Privatkunde |
|---|---|
| 2+ | 2.51 EUR |
| 10+ | 2.05 EUR |
| 112+ | 1.76 EUR |
| 512+ | 1.73 EUR |
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Technische Details 110-47-624-41-001000 Mill-Max
Description: CONN IC DIP SOCKET 24POS GOLD, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: FLASH, Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Termination: Solder, Number of Positions or Pins (Grid): 24 (2 x 12), Operating Temperature: -55°C ~ 125°C, Type: DIP, 0.6" (15.24mm) Row Spacing, Contact Material - Post: Brass Alloy, Mounting Type: Through Hole, Features: Open Frame, Packaging: Tube.
Weitere Produktangebote 110-47-624-41-001000 nach Preis ab 1.67 EUR bis 2.53 EUR
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110-47-624-41-001000 | Mill-Max Manufacturing Corp. |
 Description: CONN IC DIP SOCKET 24POS GOLDContact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: FLASH Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 24 (2 x 12) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.6" (15.24mm) Row Spacing Contact Material - Post: Brass Alloy Mounting Type: Through Hole Features: Open Frame Packaging: Tube |
auf Bestellung 512 Stücke: Lieferzeit 10-14 Tag (e) |
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| 110-47-624-41-001000 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 24POS GOLD
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: FLASH
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Contact Material - Post: Brass Alloy
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
Description: CONN IC DIP SOCKET 24POS GOLD
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: FLASH
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Contact Material - Post: Brass Alloy
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
auf Bestellung 512 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 9+ | 2.53 EUR |
| 16+ | 2.21 EUR |
| 32+ | 2.12 EUR |
| 64+ | 2.07 EUR |
| 112+ | 1.98 EUR |
| 256+ | 1.8 EUR |
| 512+ | 1.67 EUR |