Produkte > PRECI-DIP > 110-83-308-41-001101
110-83-308-41-001101

110-83-308-41-001101 Preci-dip


Catalog-1104139.pdf
Hersteller: Preci-dip
IC & Component Sockets
auf Bestellung 252 Stücke:

Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+2.27 EUR
10+1.92 EUR
25+1.81 EUR
104+1.71 EUR
260+1.55 EUR
520+1.29 EUR
1040+1.18 EUR
Mindestbestellmenge: 2
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Technische Details 110-83-308-41-001101 Preci-dip

Description: CONN IC DIP SOCKET 8POS GOLD, Part Status: Active, Contact Material - Post: Brass, Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 29.5µin (0.75µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 8 (2 x 4), Operating Temperature: -55°C ~ 125°C, Type: DIP, 0.3" (7.62mm) Row Spacing, Mounting Type: Through Hole, Features: Open Frame, Packaging: Bulk.

Weitere Produktangebote 110-83-308-41-001101 nach Preis ab 0.51 EUR bis 0.51 EUR

Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit
Preis
110-83-308-41-001101 Hersteller : Preci-Dip Default.aspx?c=14&i=121&p=23&pdf=1&dsku=110-PP-XXX-41-001101 Category: Precision sockets
Description: Socket: integrated circuits; Pitch: 2.54mm; open; THT; gold-plated
Body material: glass
Contact plating: gold-plated
Type of Socket: integrated circuits
Electrical mounting: THT
Flammability rating: UL94V-0
Terminal pitch: 2.54mm
Row pitch: 7.62mm
Max. contact resistance:: 10mΩ
Max. operating current: 1A
Contact material: beryllium copper
Connector variant: open
auf Bestellung 5976 Stücke:
Lieferzeit 14-21 Tag (e)
Anzahl Preis
5616+0.51 EUR
Mindestbestellmenge: 5616
Im Einkaufswagen  Stück im Wert von  UAH
110-83-308-41-001101 110-83-308-41-001101 Hersteller : Preci-Dip Default.aspx?c=14&i=121&p=23&pdf=1&dsku=110-PP-XXX-41-001101 Description: CONN IC DIP SOCKET 8POS GOLD
Part Status: Active
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH