110-83-318-41-530000 Mill-Max Mfg. Corp.
Hersteller: Mill-Max Mfg. Corp.SOCKETS, PLUG-IN ELECTRONIC COMPONENTS, (FOR 18 PIN DUAL-IN-LINE PACKAGES)
auf Bestellung 31 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 98.76 EUR |
| 10+ | 73.26 EUR |
| 25+ | 54.27 EUR |
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Technische Details 110-83-318-41-530000 Mill-Max Mfg. Corp.
Description: CONN IC SKT DBL, Packaging: Tube, Features: Open Frame, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 18 (2 x 9), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin-Lead, Contact Finish Thickness - Post: 300.0µin (7.62µm), Contact Material - Post: Brass Alloy, Part Status: Obsolete.
Weitere Produktangebote 110-83-318-41-530000 nach Preis ab 106.72 EUR bis 116.3 EUR
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| 110-83-318-41-530000 | Hersteller : Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 18 (2 x 9) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 300.0µin (7.62µm) Contact Material - Post: Brass Alloy Part Status: Obsolete |
auf Bestellung 21 Stücke: Lieferzeit 10-14 Tag (e) |
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| 110-83-318-41-530000 | Hersteller : Mill-Max |
IC & Component Sockets DIP Dual In Line Socket |
Produkt ist nicht verfügbar |