| Anzahl | Preis |
|---|---|
| 1+ | 14.91 EUR |
| 12+ | 13.39 EUR |
| 30+ | 12.62 EUR |
| 54+ | 12.28 EUR |
| 102+ | 11.97 EUR |
| 300+ | 10.68 EUR |
| 600+ | 10.03 EUR |
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Technische Details 110-83-964-41-001101 Preci-dip
Description: CONN IC DIP SOCKET 64POS GOLD, Features: Open Frame, Packaging: Bulk, Mounting Type: Through Hole, Type: DIP, 0.9" (22.86mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 64 (2 x 32), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 29.5µin (0.75µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Material - Post: Brass.
Weitere Produktangebote 110-83-964-41-001101 nach Preis ab 10.37 EUR bis 13.09 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung |
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| 110-83-964-41-001101 | Hersteller : Preci-Dip |
 Description: CONN IC DIP SOCKET 64POS GOLDFeatures: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.9" (22.86mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 64 (2 x 32) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
auf Bestellung 120 Stücke: Lieferzeit 10-14 Tag (e) |
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