
110-87-310-41-105101 Preci-dip

IC & Component Sockets 2.54mm, 10P, Surface mount, Gold Flash, 12.6x7.62x10.1x12.26
auf Bestellung 779 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis |
---|---|
2+ | 2.41 EUR |
10+ | 2.11 EUR |
82+ | 1.88 EUR |
533+ | 1.57 EUR |
1025+ | 1.33 EUR |
2501+ | 1.26 EUR |
3690+ | 1.16 EUR |
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Technische Details 110-87-310-41-105101 Preci-dip
Description: CONN IC DIP SOCKET 10POS GOLD, Features: Open Frame, Packaging: Bulk, Mounting Type: Surface Mount, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 10 (2 x 5), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: FLASH, Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Material - Post: Brass, Part Status: Active.
Weitere Produktangebote 110-87-310-41-105101
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110-87-310-41-105101 | Hersteller : Preci-Dip |
![]() Features: Open Frame Packaging: Bulk Mounting Type: Surface Mount Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 10 (2 x 5) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
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