110-87-310-41-105101 Preci-dip
Hersteller: Preci-dip
IC & Component Sockets 2.54mm, 10P, Surface mount, Gold Flash, 12.6x7.62x10.1x12.26
| Anzahl | Privatkunde |
|---|---|
| 1+ | 3.71 EUR |
| 10+ | 3.22 EUR |
| 25+ | 3.09 EUR |
| 82+ | 2.68 EUR |
| 287+ | 2.05 EUR |
| 533+ | 1.87 EUR |
| 2501+ | 1.86 EUR |
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Technische Details 110-87-310-41-105101 Preci-dip
Description: CONN IC DIP SOCKET 10POS GOLD, Part Status: Active, Contact Material - Post: Brass, Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: FLASH, Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 10 (2 x 5), Operating Temperature: -55°C ~ 125°C, Type: DIP, 0.3" (7.62mm) Row Spacing, Mounting Type: Surface Mount, Features: Open Frame, Packaging: Bulk.
Weitere Produktangebote 110-87-310-41-105101
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde |
|---|---|---|---|---|---|
 |
110-87-310-41-105101 | Preci-Dip |
Description: CONN IC DIP SOCKET 10POS GOLD Part Status: Active Contact Material - Post: Brass Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: FLASH Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 10 (2 x 5) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Surface Mount Features: Open Frame Packaging: Bulk |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 3690 Stücke Im Einkaufswagen Stück im Wert von UAH |
| 110-87-310-41-105101 |
|
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
Part Status: Active
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: FLASH
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 10 (2 x 5)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Surface Mount
Features: Open Frame
Packaging: Bulk
Description: CONN IC DIP SOCKET 10POS GOLD
Part Status: Active
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: FLASH
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 10 (2 x 5)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Surface Mount
Features: Open Frame
Packaging: Bulk
Produkt ist nicht verfügbar
Mindestbestellmenge: 3690 Stücke
Im Einkaufswagen
Stück im Wert von UAH