110-87-314-41-105101 Preci-dip
Hersteller: Preci-dip
IC & Component Sockets 2.54mm, 14P, Surface mount, Gold Flash, 17.7x7.62x10.1x12.26
| Anzahl | Privatkunde |
|---|---|
| 1+ | 4.63 EUR |
| 10+ | 4.16 EUR |
| 29+ | 3.53 EUR |
| 116+ | 3.52 EUR |
| 261+ | 2.84 EUR |
| 522+ | 2.64 EUR |
| 1015+ | 2.49 EUR |
Produktrezensionen
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Technische Details 110-87-314-41-105101 Preci-dip
Description: CONN IC DIP SOCKET 14POS GOLD, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 14 (2 x 7), Operating Temperature: -55°C ~ 125°C, Type: DIP, 0.3" (7.62mm) Row Spacing, Mounting Type: Surface Mount, Features: Open Frame, Packaging: Bulk, Part Status: Active, Contact Material - Post: Brass, Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: FLASH, Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm).
Weitere Produktangebote 110-87-314-41-105101
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde |
|---|---|---|---|---|---|
 |
110-87-314-41-105101 | Preci-Dip |
Description: CONN IC DIP SOCKET 14POS GOLD Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 14 (2 x 7) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Surface Mount Features: Open Frame Packaging: Bulk Part Status: Active Contact Material - Post: Brass Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: FLASH Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 551 Stücke Im Einkaufswagen Stück im Wert von UAH |
| 110-87-314-41-105101 |
|
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 14POS GOLD
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 14 (2 x 7)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Surface Mount
Features: Open Frame
Packaging: Bulk
Part Status: Active
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: FLASH
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Description: CONN IC DIP SOCKET 14POS GOLD
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 14 (2 x 7)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Surface Mount
Features: Open Frame
Packaging: Bulk
Part Status: Active
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: FLASH
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Produkt ist nicht verfügbar
Mindestbestellmenge: 551 Stücke
Im Einkaufswagen
Stück im Wert von UAH