Technische Details 110-93-308-41-105000 Mill-Max Mfg. Corp.
Description: CONN IC DIP SOCKET 8POS GOLD, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Termination: Solder, Number of Positions or Pins (Grid): 8 (2 x 4), Operating Temperature: -55°C ~ 125°C, Type: DIP, 0.3" (7.62mm) Row Spacing, Mounting Type: Surface Mount, Features: Open Frame, Packaging: Tube, Contact Material - Post: Brass Alloy, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Finish - Post: Tin-Lead, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm).
Weitere Produktangebote 110-93-308-41-105000 nach Preis ab 7.79 EUR bis 28.8 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||
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110-93-308-41-105000 | Mill-Max |
 IC & Component Sockets 8P SURF-MOUNT |
auf Bestellung 172 Stücke: Lieferzeit 10-14 Tag (e) |
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110-93-308-41-105000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 8POS GOLD Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 8 (2 x 4) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Surface Mount Features: Open Frame Packaging: Tube Contact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin-Lead Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) |
auf Bestellung 50 Stücke: Lieferzeit 10-14 Tag (e) |
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110-93-308-41-105000 | Mill-Max Mfg. Corp. |
Conn DIP Socket RCP 8 POS 2.54mm Solder ST SMD Tube |
auf Bestellung 1377 Stücke: Lieferzeit 14-21 Tag (e) |
Mindestbestellmenge: 600 Stücke Im Einkaufswagen Stück im Wert von UAH |
| 110-93-308-41-105000 |
|
Hersteller: Mill-Max
IC & Component Sockets 8P SURF-MOUNT
IC & Component Sockets 8P SURF-MOUNT
auf Bestellung 172 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 18.72 EUR |
| 10+ | 16.15 EUR |
| 25+ | 15.14 EUR |
| 50+ | 14.47 EUR |
| 100+ | 13.2 EUR |
| 250+ | 7.79 EUR |
| 110-93-308-41-105000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 8POS GOLD
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Surface Mount
Features: Open Frame
Packaging: Tube
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Description: CONN IC DIP SOCKET 8POS GOLD
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Surface Mount
Features: Open Frame
Packaging: Tube
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
auf Bestellung 50 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 28.8 EUR |
| 10+ | 24.48 EUR |
| 25+ | 22.94 EUR |
| 50+ | 21.85 EUR |
| 110-93-308-41-105000 |
|
Hersteller: Mill-Max Mfg. Corp.
Conn DIP Socket RCP 8 POS 2.54mm Solder ST SMD Tube
Conn DIP Socket RCP 8 POS 2.54mm Solder ST SMD Tube
auf Bestellung 1377 Stücke:
Lieferzeit 14-21 Tag (e)