| Anzahl | Preis |
|---|---|
| 1+ | 15.08 EUR |
| 10+ | 13.04 EUR |
| 25+ | 12.27 EUR |
| 50+ | 11.74 EUR |
| 100+ | 10.42 EUR |
| 250+ | 6.86 EUR |
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Technische Details 110-93-308-41-105000 Mill-Max
Description: CONN IC DIP SOCKET 8POS GOLD, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Termination: Solder, Number of Positions or Pins (Grid): 8 (2 x 4), Operating Temperature: -55°C ~ 125°C, Type: DIP, 0.3" (7.62mm) Row Spacing, Mounting Type: Surface Mount, Features: Open Frame, Packaging: Tube, Contact Material - Post: Brass Alloy, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Finish - Post: Tin-Lead, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm).
Weitere Produktangebote 110-93-308-41-105000 nach Preis ab 17.1 EUR bis 22.55 EUR
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110-93-308-41-105000 | Hersteller : Mill-Max Manufacturing Corp. |
 Description: CONN IC DIP SOCKET 8POS GOLDHousing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 8 (2 x 4) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Surface Mount Features: Open Frame Packaging: Tube Contact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin-Lead Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) |
auf Bestellung 50 Stücke: Lieferzeit 10-14 Tag (e) |
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