Technische Details 110-93-320-41-605000 Mill-Max Mfg. Corp.
Description: CONN IC DIP SOCKET 20POS GOLD, Features: Open Frame, Packaging: Tube, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 20 (2 x 10), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin-Lead, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Brass Alloy.
Weitere Produktangebote 110-93-320-41-605000 nach Preis ab 14.72 EUR bis 33.89 EUR
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110-93-320-41-605000 | Mill-Max Mfg. Corp. |
 Conn DIP Socket RCP 20 POS 2.54mm Solder ST Thru-Hole Tube |
auf Bestellung 1720 Stücke: Lieferzeit 14-21 Tag (e) |
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110-93-320-41-605000 | Mill-Max |
IC & Component Sockets 20P AUTO INSRT SKT 200u Sn/Pb |
auf Bestellung 99 Stücke: Lieferzeit 10-14 Tag (e) |
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110-93-320-41-605000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 20POS GOLD Features: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 20 (2 x 10) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy |
auf Bestellung 50 Stücke: Lieferzeit 10-14 Tag (e) |
|
| 110-93-320-41-605000 |
|
Hersteller: Mill-Max Mfg. Corp.
Conn DIP Socket RCP 20 POS 2.54mm Solder ST Thru-Hole Tube
Conn DIP Socket RCP 20 POS 2.54mm Solder ST Thru-Hole Tube
auf Bestellung 1720 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 60+ | 19.75 EUR |
| 110-93-320-41-605000 |
|
Hersteller: Mill-Max
IC & Component Sockets 20P AUTO INSRT SKT 200u Sn/Pb
IC & Component Sockets 20P AUTO INSRT SKT 200u Sn/Pb
auf Bestellung 99 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 26.7 EUR |
| 10+ | 22.81 EUR |
| 20+ | 21.93 EUR |
| 60+ | 21.03 EUR |
| 100+ | 17.28 EUR |
| 260+ | 15.76 EUR |
| 500+ | 14.72 EUR |
| 110-93-320-41-605000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 20POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Description: CONN IC DIP SOCKET 20POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
auf Bestellung 50 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 33.89 EUR |
| 20+ | 27.43 EUR |
| 40+ | 26.12 EUR |