110-93-328-41-001000 Mill-Max Manufacturing Corp.
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
| Anzahl | Preis |
|---|---|
| 3+ | 6.58 EUR |
| 14+ | 5.46 EUR |
| 28+ | 5.19 EUR |
| 56+ | 4.95 EUR |
| 112+ | 4.71 EUR |
| 252+ | 4.45 EUR |
| 504+ | 4.24 EUR |
| 1008+ | 4.03 EUR |
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Technische Details 110-93-328-41-001000 Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 28POS GOLD, Packaging: Tube, Features: Open Frame, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 28 (2 x 14), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin-Lead, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Brass Alloy, Part Status: Active.
Weitere Produktangebote 110-93-328-41-001000 nach Preis ab 4.22 EUR bis 6.65 EUR
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110-93-328-41-001000 | Hersteller : Mill-Max |
IC & Component Sockets 28P TIN PIN GLD CONT |
auf Bestellung 1003 Stücke: Lieferzeit 10-14 Tag (e) |
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