| Anzahl | Privatkunde |
|---|---|
| 1+ | 20.31 EUR |
| 12+ | 17.42 EUR |
| 30+ | 16.34 EUR |
| 54+ | 15.66 EUR |
| 252+ | 14.08 EUR |
| 504+ | 13.39 EUR |
| 1002+ | 12.86 EUR |
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Technische Details 110-93-964-41-001000 Mill-Max
Description: CONN IC DIP SOCKET 64POS GOLD, Part Status: Active, Contact Material - Post: Brass Alloy, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Finish - Post: Tin-Lead, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Termination: Solder, Number of Positions or Pins (Grid): 64 (2 x 32), Operating Temperature: -55°C ~ 125°C, Type: DIP, 0.9" (22.86mm) Row Spacing, Mounting Type: Through Hole, Features: Open Frame, Packaging: Tube.
Weitere Produktangebote 110-93-964-41-001000 nach Preis ab 15.98 EUR bis 21.17 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||
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110-93-964-41-001000 | Mill-Max Manufacturing Corp. |
 Description: CONN IC DIP SOCKET 64POS GOLDPart Status: Active Contact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin-Lead Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 64 (2 x 32) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.9" (22.86mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Tube |
auf Bestellung 95 Stücke: Lieferzeit 10-14 Tag (e) |
|
| 110-93-964-41-001000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 64POS GOLD
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 64 (2 x 32)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.9" (22.86mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
Description: CONN IC DIP SOCKET 64POS GOLD
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 64 (2 x 32)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.9" (22.86mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
auf Bestellung 95 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 21.17 EUR |
| 12+ | 17.78 EUR |
| 30+ | 16.66 EUR |
| 54+ | 15.98 EUR |