| Anzahl | Preis |
|---|---|
| 2+ | 1.85 EUR |
| 10+ | 1.57 EUR |
| 28+ | 1.39 EUR |
| 112+ | 1.32 EUR |
| 252+ | 1.25 EUR |
| 504+ | 1.19 EUR |
| 1008+ | 1.13 EUR |
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Technische Details 110-99-314-41-001000 Mill-Max
Description: CONN IC DIP SOCKET 14POS TINLEAD, Part Status: Active, Contact Material - Post: Brass Alloy, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Finish - Post: Tin-Lead, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Finish - Mating: Tin-Lead, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Termination: Solder, Number of Positions or Pins (Grid): 14 (2 x 7), Operating Temperature: -55°C ~ 125°C, Type: DIP, 0.3" (7.62mm) Row Spacing, Mounting Type: Through Hole, Features: Open Frame, Packaging: Tube.
Weitere Produktangebote 110-99-314-41-001000 nach Preis ab 1.14 EUR bis 1.85 EUR
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110-99-314-41-001000 | Hersteller : Mill-Max Manufacturing Corp. |
 Description: CONN IC DIP SOCKET 14POS TINLEADPart Status: Active Contact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin-Lead Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Finish - Mating: Tin-Lead Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 14 (2 x 7) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Tube |
auf Bestellung 2148 Stücke: Lieferzeit 10-14 Tag (e) |
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