110-99-320-41-001000 Mill-Max Manufacturing Corp.
Hersteller: Mill-Max Manufacturing Corp.Description: CONN IC DIP SOCKET 20POS TINLEAD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
auf Bestellung 630 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 8+ | 2.27 EUR |
| 20+ | 1.83 EUR |
| 40+ | 1.74 EUR |
| 60+ | 1.69 EUR |
| 100+ | 1.63 EUR |
| 260+ | 1.52 EUR |
| 500+ | 1.45 EUR |
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Technische Details 110-99-320-41-001000 Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 20POS TINLEAD, Features: Open Frame, Packaging: Tube, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 20 (2 x 10), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin-Lead, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin-Lead, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Brass Alloy, Part Status: Active.
Weitere Produktangebote 110-99-320-41-001000 nach Preis ab 1.21 EUR bis 2.4 EUR
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110-99-320-41-001000 | Hersteller : Mill-Max Mfg. Corp. |
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110-99-320-41-001000 | Hersteller : Mill-Max Mfg. Corp. |
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