| Anzahl | Preis |
|---|---|
| 1+ | 22.26 EUR |
| 10+ | 18.99 EUR |
| 25+ | 18.76 EUR |
| 40+ | 16.42 EUR |
| 120+ | 14.77 EUR |
| 280+ | 13.8 EUR |
| 520+ | 13.34 EUR |
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Technische Details 111-43-310-41-001000 Mill-Max
Description: CONN IC SKT DBL, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Termination: Solder, Number of Positions or Pins (Grid): 10 (2 x 5), Operating Temperature: -55°C ~ 125°C, Type: DIP, 0.3" (7.62mm) Row Spacing, Mounting Type: Through Hole, Features: Open Frame, Packaging: Tube, Contact Material - Post: Brass Alloy, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Mating: Gold.
Weitere Produktangebote 111-43-310-41-001000 nach Preis ab 19.96 EUR bis 25.84 EUR
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111-43-310-41-001000 | Hersteller : Mill-Max Manufacturing Corp. |
 Description: CONN IC SKT DBLPitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 10 (2 x 5) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Tube Contact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold |
auf Bestellung 80 Stücke: Lieferzeit 10-14 Tag (e) |
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