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111-47-306-41-001000

111-47-306-41-001000 Mill-Max


MMMC_S_A0003128315_1-2554876.pdf Hersteller: Mill-Max
IC & Component Sockets STANDRD SOLDER TAIL DIP SOCKET
auf Bestellung 823 Stücke:

Lieferzeit 14-28 Tag (e)
Anzahl Preis ohne MwSt
24+2.18 EUR
31+ 1.72 EUR
67+ 1.5 EUR
536+ 1.34 EUR
1005+ 1.19 EUR
2546+ 1.08 EUR
Mindestbestellmenge: 24
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Technische Details 111-47-306-41-001000 Mill-Max

Description: CONN IC DIP SOCKET 6POS GOLD, Packaging: Tube, Features: Open Frame, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 6 (2 x 3), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: FLASH, Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Brass Alloy, Part Status: Active.

Weitere Produktangebote 111-47-306-41-001000

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111-47-306-41-001000 111-47-306-41-001000 Hersteller : Mill-Max Manufacturing Corp. 2017-11%3A091.pdf Description: CONN IC DIP SOCKET 6POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
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