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111-91-318-41-001000 Mill-Max


MMMC_S_A0003128315_1-2554876.pdf Hersteller: Mill-Max
IC & Component Sockets DIP Dual In Line Socket
auf Bestellung 66 Stücke:

Lieferzeit 14-28 Tag (e)
Anzahl Preis ohne MwSt
2+38.17 EUR
10+ 35.46 EUR
22+ 31.82 EUR
44+ 30.91 EUR
110+ 27.27 EUR
264+ 25.45 EUR
506+ 24.91 EUR
Mindestbestellmenge: 2
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Technische Details 111-91-318-41-001000 Mill-Max

Description: CONN IC SKT DBL, Packaging: Tube, Features: Open Frame, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 18 (2 x 9), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin-Lead, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Brass Alloy, Part Status: Active.

Weitere Produktangebote 111-91-318-41-001000

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Preis ohne MwSt
111-91-318-41-001000 Hersteller : Mill-Max Manufacturing Corp. 2017-11%3A091.pdf Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
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