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114-87-308-41-134191

114-87-308-41-134191 Preci-dip


Preci_Dip_01252017_cat_135-1214473.pdf Hersteller: Preci-dip
IC & Component Sockets
auf Bestellung 420 Stücke:

Lieferzeit 14-28 Tag (e)
Anzahl Preis ohne MwSt
17+3.15 EUR
20+ 2.65 EUR
100+ 2.39 EUR
500+ 1.96 EUR
1000+ 1.74 EUR
2000+ 1.58 EUR
5000+ 1.52 EUR
Mindestbestellmenge: 17
Produktrezensionen
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Technische Details 114-87-308-41-134191 Preci-dip

Description: CONN IC DIP SOCKET 8POS GOLD, Features: Open Frame, Packaging: Tape & Reel (TR), Mounting Type: Surface Mount, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 8 (2 x 4), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: FLASH, Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Material - Post: Brass, Part Status: Active.

Weitere Produktangebote 114-87-308-41-134191

Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit
Preis ohne MwSt
114-87-308-41-134191 Hersteller : Preci-Dip catalog.pdf Connector Surface mount Pick and Place
Produkt ist nicht verfügbar
114-87-308-41-134191 114-87-308-41-134191 Hersteller : Preci-Dip Description: CONN IC DIP SOCKET 8POS GOLD
Features: Open Frame
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
114-87-308-41-134191 114-87-308-41-134191 Hersteller : Preci-Dip Description: CONN IC DIP SOCKET 8POS GOLD
Features: Open Frame
Packaging: Cut Tape (CT)
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar