| Anzahl | Privatkunde |
|---|---|
| 1+ | 5.68 EUR |
| 10+ | 4.9 EUR |
| 28+ | 4.33 EUR |
| 112+ | 4.13 EUR |
| 252+ | 3.89 EUR |
| 504+ | 3.71 EUR |
| 1008+ | 3.44 EUR |
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Technische Details 115-43-314-41-003000 Mill-Max
Description: CONN IC DIP SOCKET 14POS GOLD, Type: DIP, 0.3" (7.62mm) Row Spacing, Mounting Type: Through Hole, Features: Open Frame, Packaging: Tube, Part Status: Active, Contact Material - Post: Brass Alloy, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Termination: Solder, Number of Positions or Pins (Grid): 14 (2 x 7), Operating Temperature: -55°C ~ 125°C.
Weitere Produktangebote 115-43-314-41-003000 nach Preis ab 3.38 EUR bis 5.87 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||||||||
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115-43-314-41-003000 | Mill-Max Manufacturing Corp. |
 Description: CONN IC DIP SOCKET 14POS GOLDType: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Tube Part Status: Active Contact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 14 (2 x 7) Operating Temperature: -55°C ~ 125°C |
auf Bestellung 5615 Stücke: Lieferzeit 10-14 Tag (e) |
|
| 115-43-314-41-003000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 14POS GOLD
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 14 (2 x 7)
Operating Temperature: -55°C ~ 125°C
Description: CONN IC DIP SOCKET 14POS GOLD
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 14 (2 x 7)
Operating Temperature: -55°C ~ 125°C
auf Bestellung 5615 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 4+ | 5.87 EUR |
| 10+ | 4.99 EUR |
| 28+ | 4.64 EUR |
| 56+ | 4.41 EUR |
| 112+ | 4.21 EUR |
| 252+ | 3.97 EUR |
| 504+ | 3.78 EUR |
| 1008+ | 3.61 EUR |
| 2520+ | 3.38 EUR |