115-47-320-41-001000 Mill-Max
auf Bestellung 1486 Stücke:
Lieferzeit 14-28 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
12+ | 4.37 EUR |
14+ | 3.82 EUR |
100+ | 3.41 EUR |
500+ | 2.83 EUR |
1000+ | 2.42 EUR |
2500+ | 2.27 EUR |
5000+ | 2.16 EUR |
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Technische Details 115-47-320-41-001000 Mill-Max
Description: CONN IC DIP SOCKET 20POS GOLD, Features: Open Frame, Packaging: Tube, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 20 (2 x 10), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: FLASH, Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Brass Alloy, Part Status: Active.
Weitere Produktangebote 115-47-320-41-001000 nach Preis ab 25.78 EUR bis 25.78 EUR
Foto | Bezeichnung | Hersteller | Beschreibung |
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115-47-320-41-001000 | Hersteller : Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 20POS GOLD Features: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 20 (2 x 10) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
auf Bestellung 60 Stücke: Lieferzeit 10-14 Tag (e) |
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