| Anzahl | Preis |
|---|---|
| 1+ | 20.52 EUR |
| 10+ | 19.61 EUR |
| 56+ | 19.59 EUR |
| 112+ | 16.65 EUR |
| 252+ | 14.38 EUR |
| 504+ | 13.24 EUR |
| 1008+ | 12.72 EUR |
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Technische Details 116-43-314-41-006000 Mill-Max
Description: CONN IC DIP SOCKET 14POS GOLD, Part Status: Active, Contact Material - Post: Brass Alloy, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Termination: Solder, Number of Positions or Pins (Grid): 14 (2 x 7), Operating Temperature: -55°C ~ 125°C, Type: DIP, 0.3" (7.62mm) Row Spacing, Mounting Type: Through Hole, Features: Elevated, Open Frame, Packaging: Tube.
Weitere Produktangebote 116-43-314-41-006000 nach Preis ab 19.68 EUR bis 23.14 EUR
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116-43-314-41-006000 | Hersteller : Mill-Max Manufacturing Corp. |
 Description: CONN IC DIP SOCKET 14POS GOLDPart Status: Active Contact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 14 (2 x 7) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Elevated, Open Frame Packaging: Tube |
auf Bestellung 21 Stücke: Lieferzeit 10-14 Tag (e) |
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