auf Bestellung 208 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 6.02 EUR |
| 10+ | 5.47 EUR |
| 21+ | 5.17 EUR |
| 42+ | 5.05 EUR |
| 105+ | 4.8 EUR |
| 252+ | 4.21 EUR |
| 504+ | 4.08 EUR |
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Technische Details 116-87-320-41-008101 Preci-dip
Description: CONN IC DIP SOCKET 20POS GOLD, Packaging: Tube, Features: Elevated, Open Frame, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 20 (2 x 10), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: FLASH, Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Material - Post: Brass, Part Status: Active.
Weitere Produktangebote 116-87-320-41-008101 nach Preis ab 4.55 EUR bis 6.32 EUR
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116-87-320-41-008101 | Hersteller : Preci-Dip |
 Description: CONN IC DIP SOCKET 20POS GOLDPackaging: Tube Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 20 (2 x 10) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
auf Bestellung 355 Stücke: Lieferzeit 10-14 Tag (e) |
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