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116-93-304-41-008000 Mill-Max Manufacturing Corp.


2017-11%3A111.pdf
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 4POS GOLD
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 4 (2 x 2)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
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Technische Details 116-93-304-41-008000 Mill-Max Manufacturing Corp.

Description: CONN IC DIP SOCKET 4POS GOLD, Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Termination: Solder, Number of Positions or Pins (Grid): 4 (2 x 2), Operating Temperature: -55°C ~ 125°C, Type: DIP, 0.3" (7.62mm) Row Spacing, Mounting Type: Through Hole, Features: Elevated, Open Frame, Packaging: Tube, Contact Material - Post: Brass Alloy, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Finish - Post: Tin-Lead, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 30.0µin (0.76µm).

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116-93-304-41-008000 Hersteller : Mill-Max 111-259666.pdf IC & Component Sockets 4 PIN ELEVATED SKT .472L
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