116-93-318-41-007000 Mill-Max Manufacturing Corp.
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 18POS GOLD
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 18 (2 x 9)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Part Status: Active
Packaging: Tube
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
| Anzahl | Preis |
|---|---|
| 1+ | 31.47 EUR |
| 22+ | 23.91 EUR |
| 44+ | 22.49 EUR |
| 66+ | 21.69 EUR |
| 110+ | 20.73 EUR |
| 264+ | 19.57 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details 116-93-318-41-007000 Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 18POS GOLD, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Termination: Solder, Number of Positions or Pins (Grid): 18 (2 x 9), Operating Temperature: -55°C ~ 125°C, Type: DIP, 0.3" (7.62mm) Row Spacing, Mounting Type: Through Hole, Features: Elevated, Open Frame, Part Status: Active, Packaging: Tube, Contact Material - Post: Brass Alloy, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Finish - Post: Tin-Lead, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper.
Weitere Produktangebote 116-93-318-41-007000
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
| 116-93-318-41-007000 | Hersteller : Mill-Max |
IC & Component Sockets 18 PIN ELEVATED SKT .402L |
Produkt ist nicht verfügbar |